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Equipment Matters in Solder Paste Printing

December 6, 2017 | Stephen Las Marias, I-Connect007

The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

HDI: Born in the USA and Making a Comeback

November 22, 2017 | Patty Goldman, I-Connect007

There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.



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