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FEATURED ARTICLES AND COLUMNS:

Chapter 5 of the 2nd Volume from The Printed Circuit Designer's Guide to... Thermal Managment with Insulated Metal Substrates provides examples of thermally enhanced prepregs and cores now available in the market with the versatility to solve a wide variety of challenges. Included in this chapter you will find examples of simple designs and more complex hybrid assemblies that combine multilayer and single-layer areas on the same board.

The Electronics Industry’s Guide to… The Evolving PCB NPI Process is the first book in I-Connect007’s new The Electronics Industry’s Guide to… technical series. This valuable resource is for all segments of the electronics interconnect industry.




MORE ARTICLES

Time to Invest? Featuring:

  • The Challenges of the 2022 PCB Market: The Party’s Over by Pete Starkey
  • Is the U.S. Government Ready to Meet the Test of Technological Leadership? by John Mitchell
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Today’s M&A: Right on Target with Tom Kastner
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with Travis Kelly and Rep. Blake Moore
  • PCB Finance Class with Jeff De Serrano

Supply 'Pain' Management Featuring:

  • Digi-Key Drilling Down on Counterfeit with Levy Olson and Kelsey Lawrence
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with U.S. Rep. B. Moore and T. Kelly
  • A Framework for Managing Supply Chain Disruption by Chintan Sutaria
  • Thriving Through Greater EMS Collaboration by Christopher Peters
  • Supply ‘Pain’ Management by Nolan Johnson
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