The IPC High-Reliability Forum for Mil-Aero and Automotive Sectors

September 24, 2018 | Happy Holden, I-Connect007

I-Connec007’s Happy Holden had the pleasure of attending IPC’s High Reliability Forum (HRF) in Baltimore in May. As the IPC scripted it, it was a “Technical Conference with a Focus on Electronics Subjected to Harsh-Use Environments.”

PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective

August 28, 2018 | Pete Starkey, I-Connect007

The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.


Filling the Gap: Underfill Rework

September 21, 2018 | Bob Wettermann, BEST, Inc.

Rework technicians must take into account a variety of factors when considering whether or not to rework underfilled components, such as BGAs, CSPs, flip chips, and other component packages on handheld devices. But without a full...

EPTE Newsletter: New Materials for Wearable Electronics

September 20, 2018 | Dominique Numakura, DKN Research

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for...

Artificial Intelligence: Super-Exciting, Ultra-Competitive

September 18, 2018 | Dr. Jennie Hwang, H-Technologies Group

Artificial intelligence (AI) and machine learning (ML) have become common everyday words, however, the present reality and future potential are yet to evolve. This article looks into the key considerations and strategies to better...

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