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LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry

05/13/2024 | LPKF
The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing.

ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus

05/13/2024 | SEMI
The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.

iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

05/13/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling.

Korean Semiconductor Industry Titans Back DEEPX in Series C Funding Round

05/13/2024 | PRNewswire
DEEPX, a prominent AI semiconductor technology startup under the leadership of CEO Lokwon Kim, is delighted to announce the successful conclusion of its Series C funding round, amassing $80.5M (KRW 110B).

SEMI Recognizes U.S. Senator Majority Leader Charles Schumer With Government Leadership Award for Outstanding Support of U.S. Chip Industry

05/13/2024 | SEMI
SEMI, the industry association serving the global electronics design and manufacturing supply chain, announced that the SEMI North America Advisory Board has presented the annual SEMI Americas Government Leadership Award to U.S. Senate Majority Leader Charles (Chuck) Schumer in recognition of his extraordinary support of the U.S. semiconductor industry.
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