EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- Alun Morgan Named Technology Ambassador for Ventec International Group

- Call for Papers: EIPC Winter Conference Milan, February 14–15, 2019

News from Norway 

- Elmatica Welcomes Former Secretary of State and Cisco Director to the Board of Directors

Electronics Industry News

- Taiwan Sees More Firms Willing to Move Production Back from China

- Audit Checklist Targets Fake Chips

Click here for the International Events Diary 2018 

Click here to download the complete SpeedNews Issue 21

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Technology Ambassador Alun Morgan

12/10/2018 | Barry Matties, I-Connect007
Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

12/05/2018 | Pete Starkey, I-Connect007
At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

Ventec Keeps 'Shaking Things Up' with tec-speed 20.0

09/10/2018 | Barry Matties, I-Connect007
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.



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