North American PCB Industry Growth Cycle Continues; August Book-to-Bill Ratio Steady at 1.05


Reading time ( words)

IPC—Association Connecting Electronics Industries announced today the August 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for August held steady at 1.05.

Total North American PCB shipments in August 2018 were up 8.7% compared to the same month last year. This year to date, shipments are 10.3% above the same period last year. Compared to the preceding month, August shipments increased 6.5%.

PCB bookings in August increased 6.8% year-over-year. Year-to-date order growth was 11.0% above the same period last year. Bookings in August were up 9.4% from the previous month.

"North American PCB industry sales and orders continued to grow in August compared to the previous month and the same period last year,” said Sharon Starr, IPC’s director of market research. “August was the 12th consecutive month of year-over-year sales growth and the 15th month of continuous order growth. The book-to-bill ratio in August remained above parity (1.0) for the 19th consecutive month, which is a positive indicator of continued growth for the rest of this year.”

Detailed Data Available

The next edition of IPC’s North American PCB Market Report, containing detailed third-quarter 2018 data from IPC’s PCB Statistical Program, will be available in November. The quarterly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. PCB companies that are IPC members doing business in North America are invited to contact marketresearch@ipc.org for information about participating. More information about this report can be found at www.ipc.org/market-research-reports.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio at the end of each month. Statistics for the current month are normally available in the last week of the following month.

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,400 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Brussels, Belgium; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.

Share


Suggested Items

Defense Speak Interpreted: Defense Electronic Supply Chain Issues

10/09/2018 | Dennis Fritz, Fritz Consulting
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.

SLP: The Next Level of Technology

10/02/2018 | Patty Goldman, I-Connect007
As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?

The IPC High-Reliability Forum for Mil-Aero and Automotive Sectors

09/24/2018 | Happy Holden, I-Connect007
I-Connec007’s Happy Holden had the pleasure of attending IPC’s High Reliability Forum (HRF) in Baltimore in May. As the IPC scripted it, it was a “Technical Conference with a Focus on Electronics Subjected to Harsh-Use Environments.”



Copyright © 2018 I-Connect007. All rights reserved.