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Real Time with... IPC APEX EXPO 2024: MYCRONIC's Evolution and New Solutions

04/17/2024 | Real Time with...IPC APEX EXPO
Henry Crandall interviews Kevin Clue, the vice president of global sales for MYCRONIC's High Flex division. They discuss the company's evolution, emphasizing its strong customer relationships and its role as a versatile, turnkey solution provider. Kevin unveils new solutions launched at IPC APEX EXPO, including an AI-integrated inspection system and the A40 pick-and-place platform. The conversation also touches on the increased use of AI and deep learning.

Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding

04/17/2024 | SCHMID Group
Australian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)

Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense

04/16/2024 | ANSYS
Ansys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).

Designing Electronics for High Thermal Loads

04/16/2024 | Akber Roy, Rush PCB Inc.
Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.

SIA Applauds CHIPS Act Incentives for Samsung Manufacturing Projects in Texas

04/16/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Samsung.
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