Reading time ( words)
RBP’s ONYX™ is a Direct Metallization System for high reliability and complex printed circuit boards.
The RBP ONYX™ Direct Metallization Process is an integrated system based on a highly conductive form of finely dispersed graphite. Extensively tested and validated, the ONYX™ Process has proven to be versatile and cost effective. Currently the customer base using ONYX™ processes flex, rigid-flex, HDI and high aspect ratio multilayer printed circuit boards with ease and cost effectiveness when compared to conventional electroless copper. The ONYX™ process easily surpasses industry reliability standards including IST (interconnection stress test) and ATC (accelerated thermal cycling).
ONYX™ Direct Metallization System Highlights
The ONYX™ Direct Metallization System is a versatile process and is used in horizontal conveyorized equipment or in vertical immersion mode. Fabricators are able to process a vast array of resin materials including PTFE, polyimide, BT, flex, and basically all epoxy-based resin systems on the market today.
This process is an alternative to electroless copper deposition and provides several significant benefits to the fabricator:
- Less expensive than conventional electroless copper
- Smaller equipment footprint compared to electroless copper
- Greatly reduced water consumption, 4−6 gallons/minute, compared to conventional electroless copper, 26−30 gallons per minute
- ONYX™ contains no chelator as opposed to electroless copper—simplifying waste treatment
RBP Chemical Technology is a leading supplier of proprietary chemicals for printed circuit fabrication and semiconductor test applications. RBP’s chemical formulas are tailored to meet the precise needs and requirements for advanced circuit boards, primarily in aerospace, medical and military applications. Headquartered in Milwaukee, Wisconsin and expanding globally, RBP is certified to ISO 9001:2015 and is the Intelligent Choice for the electronics industry.