Ann Ackerson Named Chief Procurement Officer for BAE Systems
April 17, 2020 | Business WireEstimated reading time: 1 minute
BAE Systems has named Ann Ackerson to become the global Chief Procurement Officer (CPO), effective May 4, 2020. Ackerson will report to the BAE Systems, Inc. organization with a functional reporting line to BAE Systems plc. As a member of the Inc. senior leadership team and chair of the Global Procurement Council, Ackerson will lead the company’s global supply chain strategy to maximize the purchasing power of the global enterprise.
“Ann is a proven leader with extensive supply chain experience and customer focus across multiple industries,” said Tom Arseneault, BAE Systems, Inc. president and CEO. “I look forward to welcoming her to the team as we continue our journey towards supply chain excellence.”
Most recently, Ackerson served as the senior vice president of Global Supply Chain Management for Freeman, standing up and leading the global supply chain function for the company, and included strategic procurement, distribution and warehousing, inventory supply planning, transportation, and sustainability. Prior to her role at Freeman, Ackerson was the CPO and vice president of Supply Chain Management at Dresser-Rand. During her career, Ackerson has more than 30 years of experience in procurement and supply chain management spanning a range of industries.
Ackerson will succeed Paul Smith, who will begin serving as vice president and general manager of BAE Systems, Inc.’s Ship Repair business on June 15, replacing Joe Campbell, who has announced his intent to retire later this year.
Suggested Items
Camtek Receives Approx. $25M from tier-1 manufacturer for High Bandwidth Memory (HBM)
03/29/2024 | CamtekCamtek Ltd. announced that it has received a new order for approximately $25 million from a tier-1 HBM manufacturer, for the inspection and metrology of High Bandwidth Memory (HBM). Most of the systems are expected to be delivered in the second half of 2024.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24
03/26/2024 | CentraTEQEnvironmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.