US Market Première of Ventec aerolam Base Material Solutions for Aerospace & Defense Electronics
January 10, 2022 | VentecEstimated reading time: 1 minute
At IPC APEX Expo 2022 in San Diego, Ventec International Group Co., Ltd. (6672 TT) will be premiering ‘aerolam’ in the US-market. A base-material solutions set, aerolam is specifically curated for the diverse and unique requirements of aerospace & defense applications. From January 25 to 27, the Ventec team will be on hand at booth #3325 for the unveiling of aerolam and to showcase its unique laminate & prepreg capability across a very wide range of applications and budgets.
The evolution of aerospace and defense (A&D) electronics is accelerating at a staggering pace, driving the demand for reliable high-performance materials that maintain mechanical and electrical integrity in harsh mission-critical operating conditions. Paying attention to the properties of materials at the substrate level is the first step towards achieving the most stringent performance targets of today's A&D manufacturers.
Whatever the substrates must handle – high-speed digital signals, high RF frequencies, intense heat dissipation, extreme environmental stresses – the aerolam portfolio guides designers and manufacturers of high-performance A&D electronics to high-quality products that are ready to meet those demands and are supported by all the necessary documentation including test schedules and certificates of conformity.
The aerolam portfolio caters for the complete spectrum of A&D application scenarios, from equipment intended to operate in a relatively benign environment such as inside a command-and-control center, to high-performance fielded systems that must withstand the toughest conditions including extreme temperatures, high vibration and g-forces, salt spray, and humidity that challenge reliability to the utmost.
Ventec’s Quality Management Systems are of course accredited with AS9100 quality standard, and conversant with applicable IPC, space agency and MIL-STD specifications, reflecting Ventec’s commitment to meet the strictest industry requirements for aerospace-related products.
Check out this additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh (a free eBook available for download)
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007e Book library here
Suggested Items
Cicor Records Solid Growth in Q1
04/16/2024 | CicorThe Cicor Group continued to grow in the first three months of the year. Quarterly sales increased by 11.8% to CHF 107.3 million compared to the first quarter of the previous year (Q1/2023: CHF 96.0 million).
TT Electronics Awarded Contract with Kongsberg Defence and Aerospace
04/11/2024 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced today that its Fairford UK business has been awarded a new contract with long-standing customer Kongsberg Defence and Aerospace (Kongsberg) for the production of complex cable harness solutions.
Cicor Successfully Completes Acquisition of TT Electronics IoT Solutions Ltd.
04/03/2024 | CicorThe Cicor Group has successfully completed the acquisition of TT Electronics IoT Solutions Ltd. with three production sites in the UK and China.
Absolute EMS Successfully Recertifies ISO 9001:2015 and AS9100 Standards
03/26/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, is proud to announce the successful recertification of its ISO 9001:2015 and AS9100 Rev D SAE International Aerospace Standards.
Arlon EMC Receives IPC-4101 QPL Recertification
03/20/2024 | Arlon Electronic MaterialsArlon Electronic Materials has successfully completed an intensive two-day recertification audit by IPC Validation Services that examined Arlon’s manufacturing processes and testing procedures to assure that they are in conformance to the requirements of IPC-4101E-WAM1, the Specification for Base Materials for Rigid and Multilayer Printed Boards.