IPC Offers First Advanced Packaging Symposium
August 5, 2022 | IPCEstimated reading time: 1 minute
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
“Fundamental changes in the semiconductor sector are impacting the electronics manufacturing supply chain, and lines are blurring between IC-substrate and printed circuit board fabrication and between semiconductor and electronics assembly,” said Matt Kelly, IPC chief technologist. “Understanding these industry changes will ensure the emergence of innovative, well-balanced, and resilient ecosystems to support the production of the most cutting-edge semiconductor components.”
The two-day event, which includes three keynotes, 28 speakers, and eight sessions, will bring commercial and defense electronic industry leaders together to focus on high-priority needs for IC-substrates and packaging, to identify key challenges to overcome, enabling sustainable businesses over the long run, to move past general issue awareness into actionable research, development, design, and business operations execution, and to provide attendees with actionable next steps and an expanded network for continued development efforts.
Attendees can expect:
Speakers that span the advanced packaging ecosystem and semiconductor supply chain: component makers, HDI PCB fabricators, market-leading IC-Substrate fabricators, assembly and test manufacturers, equipment, and material suppliers.
Three keynotes from senior leaders at Intel, Department of Defense, and TechSearch International.
An eight-session agenda includes the latest insights from the Department of Commerce, Department of Defense, European Commission, Intel, NIST, Northrop Grumman, Raytheon, Schweizer Electronic, SEMCO, SkyWater, TechSearch International, TTM, and Western Digital among others.
For information on registration, visit: IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem.
Suggested Items
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
IPC WinterCom 2024 Through the Eyes of One Dedicated Student
04/12/2024 | Sanjay Huprikar, IPCLauriane Testuz stands as a testament to the power of curiosity, perseverance, and the relentless pursuit of knowledge. Her story serves as a reminder that the path to success is often paved by an unwavering commitment to one's dreams.
2023: Year of Extremes for VDL Groep
04/08/2024 | VDL GroepThe year 2023 showed us two sides, with highs and lows. Low points were the passing of Wim van der Leegte in November, the reduction in the number of employees at VDL Nedcar and headwind in the Buses & Coaches division.
IPC, First and Only Organization in the Electronics Industry to Earn ANSI/ANAB Accreditation for Its Workforce Training
04/02/2024 | IPCIPC, the global leader in electronics education, announces a landmark achievement in professional education and training. Ten of IPC’s critical workforce training programs have been accredited by the ANSI National Accreditation Board (ANAB) under the stringent requirements of ANSI/ASTM E2659-18, Standard Practice for Certificate Programs.
Nolan’s Notes: Do More, Get More
04/02/2024 | Nolan Johnson -- Column: Nolan's NotesThis month in SMT007 Magazine, we’re investigating box build, a manufacturing sector so closely adjacent to board assembly that some OEM customers they’re the same thing. To those of us doing this work, we know they’re very different. Traditional electronic assembly work is typically concerned only with attaching the components to the circuit board. That’s our idea of a “finished good.”