IPC Offers First Advanced Packaging Symposium

Reading time ( words)

Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe. 

“Fundamental changes in the semiconductor sector are impacting the electronics manufacturing supply chain, and lines are blurring between IC-substrate and printed circuit board fabrication and between semiconductor and electronics assembly,” said Matt Kelly, IPC chief technologist. “Understanding these industry changes will ensure the emergence of innovative, well-balanced, and resilient ecosystems to support the production of the most cutting-edge semiconductor components.”

The two-day event, which includes three keynotes, 28 speakers, and eight sessions, will bring commercial and defense electronic industry leaders together to focus on high-priority needs for IC-substrates and packaging, to identify key challenges to overcome, enabling sustainable businesses over the long run, to move past general issue awareness into actionable research, development, design, and business operations execution, and to provide attendees with actionable next steps and an expanded network for continued development efforts.

Attendees can expect:

Speakers that span the advanced packaging ecosystem and semiconductor supply chain: component makers, HDI PCB fabricators, market-leading IC-Substrate fabricators, assembly and test manufacturers, equipment, and material suppliers.

Three keynotes from senior leaders at Intel, Department of Defense, and TechSearch International.

An eight-session agenda includes the latest insights from the Department of Commerce, Department of Defense, European Commission, Intel, NIST, Northrop Grumman, Raytheon, Schweizer Electronic, SEMCO, SkyWater, TechSearch International, TTM, and Western Digital among others.

For information on registration, visit: IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem.


Suggested Items

PCB Technologies Sees Substrates as a Foundation

10/27/2022 | Nolan Johnson, I-Connect007
In this interview, PCB Technologies CEO Oved Shapira discusses the company's move into advanced packaging and heterogenous integration. Shapira explains how substrates and advanced packaging fit into the PCB fab and assembly ecosystem, and makes the argument that an all-inclusive fabrication and assembly supplier can be of great value to customers in product development and small scale production.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/09/2022 | Andy Shaughnessy, I-Connect007
It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?

IPC Advanced Packaging Symposium to Draw Industry, Government Representatives

08/22/2022 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium, scheduled for October 11-12, 2022 in Washington, DC. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the value to both fabricators and assemblers in attending.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.