EWPTE 2023: A Review by Happy Holden
While IPC was hosting its annual SummerCom mid-year standards event, WHMA was hosting its own “wire show,” co-located in Milwaukee, Wisconsin. During IPC SummerCom 2023 more than 90 meetings from May 13–18 were conducted, ranging from very small to very large groups. Some meetings only lasted an hour, while others were four to eight hours. WHMA is a much smaller technical association than IPC, but it provides the connectivity between our boards, assemblies, and the myriad sensors and actuators used in modern electrical and electronic systems. Wire is the principal conduit, but the variety and complexity of these configurations seem endless.
Mark Laing Talks ‘Sustainability in Manufacturing’
Now available on Spotify, Episode 3 of I-Connect007’s new podcast, On the Line with… features an interview with Mark Laing, business development manager for digital industries software at Siemens. Laing discusses the role of electronics in achieving sustainability. Not only does the electronics industry have a primary role to play here, but it also contributes by creating products which enable other industries to monitor and optimize their sustainability practices.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, our must-reads include reporting on the new PCB support legislation, now submitted to the U.S. House of Representatives; financial results from two Tier 1 manufacturers, which readers read quite thoroughly; ESG in Asia Pacific; new features from Altium; global sourcing; and a “How I got here” interview with an up and coming industry expert.
I-Connect007 Launches 'On the Line with...' Podcast with Series on Sustainability
Expanding its avenues of content delivery, I-Connect007 is excited to announce the launch of our latest educational product, On the Line with.., available on Spotify, Apple and all the major podcast platforms. In this podcast, we speak with industry experts to get the latest insights and perspectives on the most relevant topics in the electronics industry today.
Flex, Rigid-flex, and Rigidized Flex: What’s Right for You?
I recently spoke with Mike Morando, director of sales and marketing for PFC Flexible Circuits and a contributor for Flex007. I asked Mike to discuss the latest innovations at PFC, as well as some of the trends he’s seeing in flex and rigid-flex circuits now. Mike also discusses rigidized flex, a technology that is an alternative to rigid-flex circuits—one that can save customers up to 20% compared to rigid-flex. Innovation in the flex arena never seems to stop.
Watch Now: ‘Business Cases Leveraging the IPC CFX-QPL,’ Episode 10 of ‘Smarter Manufacturing Enabled with Inspection Data’
In this episode, Koh Young topic expert Ivan Aduna covers the most essential topics, messages, and sections used for inspection in the IPC CFX-QPL and how they can help you stay ahead of the curve in digital transformation. Join Ivan as he explores business cases that demonstrate the capability of the IPC CFX-QPL.
Realizing the Promise of IPC-1791
IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements, is an electronics standard developed in collaboration with the U.S. Department of Defense (DoD) and industry to address some of today’s greatest risks to a trusted supply chain. The standard provides traceability and helps protect against counterfeits. In fact, IPC-1791 was specifically cited in the U.S. Department of Commerce response to Executive Order 14017-Securing America’s Supply Chains.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, I’m identifying key news about EVs, orbital payloads, environmental sustainability, the state of the economy, and new executive leadership. I’d say it’s a well-rounded selection of what’s happening in the industry. I can’t help but continue to be impressed by the pervasiveness of space commercialization. Satellites have a long history of being commissioned and operated by private business, but as commercial launch vehicles become more available, it seems that satellite launches are accelerating. Read on!
Taking Charge of ESD
At the recent SMTA Boise Expo & Tech Forum, Barry Matties spoke with Doug Holtz, national sales manager of Conductive Containers, about challenges related to ESD and where manufacturers are most vulnerable. It’s a growing concern, Doug says, and there are important lessons to be learned. Doug also reviews his presentation, and he points out how reducing touchpoints in the supply chain can make a world of difference for both customers and manufacturers.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
SpaceX is back in the news and in a big, powerful, let’s-blow-up-a-rocket-because-we-can kind of way. The company had scheduled a test launch on Monday, April 17 for the SpaceX Starship, only to scrub that launch until this past Thursday. Well, the results from the launch were less than desirable—or were they? While Starship ultimately exploded just prior to stage separation, simply clearing the launchpad was considered a major milestone by SpaceX.
Panel Discussion: CMMC and Cybersecurity
The electronics manufacturing sector faces unique challenges when it comes to cybersecurity, given the highly sensitive nature of the information that it handles. With the introduction of the Cybersecurity Maturity Model Certification (CMMC) framework, businesses will soon be required to meet specific, more stringent cybersecurity standards to bid on Department of Defense contracts. This has made cybersecurity hygiene and CMMC compliance more important than ever for businesses in the sector, as non-compliance can result in lost revenue and reputational damage.
Steven Bowles: Taking a Stand
Steven Bowles, an associate fellow at Lockheed Martin Space, talks about his journey as a leader in IPC, beginning with the unexpected opportunity that launched his leadership career across a range of professional committees. True progress, Steven says, requires input from a diverse set of perspectives alongside the passion that drives our industry forward.
I-Connect007 Editor’s Choice: Top Five Must-Reads for the Week
The adage about spring weather in Northern temperate climates is, “April showers bring May flowers.” This is, of course, on the heels of March, when the weather comes “In like a lion, out like a lamb.” The suggestion for March is that whatever way the month starts, it will end just the opposite. But we’re in the first week of April, where things are expected to settle into a steady state of preparation for an abundance just over the horizon. Sound a bit like our business climate right now, doesn’t it?
Don Kinard: Let’s Go Where We’ve Never Gone Before
I spoke with Dr. Don A. Kinard, a senior fellow at Lockheed Martin, at the recent SMTA Dallas Expo. Don gave a fantastic presentation on digital twin technology and how it has changed Lockheed’s manufacturing process. In this interview, Don shares some insight into implementing digital twin, trends in the supply chain, and the CHIPS Act’s effect on our industry. He also discusses—importantly—the need to inspire our next generation of engineers with the same sense of wonder that Americans felt during the early Apollo missions.
PCBAA Reacts to Implications of Biden’s PCB Determination
Hot on the heels of the news that U.S. President Biden signed a presidential determination in support of the printed circuit board industry, I-Connect007’s Nolan Johnson spoke with David Schild, executive director of the Printed Circuit Board Association of America, about some of the expected implications. David points out, among other things, that this signals increased momentum with government and defense to support U.S.-based printed circuit manufacturing, and the possibility that a renewed interest in the industry by private financing could possibly follow.
Invested in Growth
The I-Connect007 team paid a visit to American Standard Circuits in West Chicago, Illinois. While there, we talked at length with CEO Anaya Vardya about the issues on his mind as he pushes technology, expands his floor space, and considers the implications of the CHIPS Act, staffing issues, and what’s happening in China.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Texans like to say that everything is bigger in Texas. That certainly seems to be the case for the SMTA Dallas Expo & Tech Forum. Publisher Barry Matties and I attended SMTA Dallas on Tuesday, and the tabletop show has now grown to 100 exhibitors, up from 92 vendors last year. It’s become more than a local or regional show, with some exhibitors flying in from Silicon Valley and the East Coast.
Garry McGuire: Aiming for the Stars
Garry McGuire of the Jacobs Space Exploration Group at Marshall Space Flight Center in Huntsville, Alabama, reflects on the serendipitous moment that led to a leadership role at IPC and the enduring relationships he’s built through his participation in the organization. With the rapid advance of technology constantly pushing the industry forward, Garry urges newcomers to jump in and experience all IPC has to offer.
Bigelow: Bullish on Fab’s Future
Twenty-plus years is a long time to lead a business during a long decline in the industry, but IMI President and CEO Peter Bigelow remains quite confident about the future. The company is in a strong financial position, running well, and looking at new technologies. So, what’s his biggest challenge? It’s not much different than any other manufacturer you talk to, and while he may not have all the answers, he’s clearly got insight to share.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s almost as if upheaval is the new normal. We often describe slow-moving but unstoppable change as moving in “geologic time.” But occasionally–like an earthquake–geology shifts suddenly. Here in my office, tracking the news of the industry, things are moving faster than geologic time, but more slowly than the jolt of an earthquake. The wave seems almost surfable, where before it seemed overwhelming. In this week’s list, we bring news from five different, high-vibration areas in our industry. If you read nothing else this week, these five items will keep you informed.
The Summit View of the Marketplace
Investments, staffing, cybersecurity, and a peek into his crystal ball—John Vaughan, vice president of strategic markets at Summit Interconnect, sits down with Nolan Johnson to talk about it all. Business is good, by the way, thanks to Summit’s portfolio of military contracts, and he has sound advice to offer for smaller shops in the United States, and their real ability to make a difference in PCB fabrication.
The Automated Future of PCB Fabrication
I have always felt that automation has the potential to make a big difference in our PCB industry, especially domestically, where labor is at premium. For the past year, I have been looking for the story of how automation can and will make a significant difference in established PCB shops. I was fortunate enough to find that story in Multicircuits, located in Oshkosh, Wisconsin. Only a few short years ago, this company was considered a “plain vanilla” PCB fabricator holding its own in our industry; now it has suddenly assumed a true leadership position in the industry in terms of capability, technology, operations, and profitability.
Boeing, Shield AI Set to Collaborate on Artificial Intelligence, Autonomy for Defense Programs
Boeing and Shield AI have signed a memorandum of understanding to explore strategic collaboration in the areas of autonomous capabilities and artificial intelligence on current and future defense programs. Shield AI created Hivemind, an artificial intelligence pilot that has flown a variety of aircraft. According to Shield AI, the AI pilot can also enable swarms of drones and aircraft to operate autonomously without GPS, communications or a human pilot in the cockpit.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I try to not talk about the weather in this space, but this week I feel compelled. I’m based in the Pacific Northwest, and we’re relatively used to it being wet and rainy. But just south of us in California, the state has gone from what I read has been called the driest period in the West in the past 1,200 years to a right proper drenching. This week’s news cycle felt like one of those California-style “atmospheric rivers.” There was so much worthy reporting worthy that I was a bit overwhelmed in making my final selections. Suffice it to say that, this week, there is quite a bit of news that’s worth your time to read.
Curtis Grosskopf: Lasting Connections Fuel Progress
Dieter Bergman IPC Fellowship Award winner Curtis Grosskopf, a senior engineer at IBM, reflects on the evolution of IPC committees and the vital importance of their work, especially in collaboratively creating industry-wide standards to guide the work of professionals in every sector. This commitment to multidisciplinary cooperation is a mindset that should be fostered at the start of every career.
Are You Offering Options in Your Bill of Materials?
In this interview, Saline Lectronics (an Emerald EMS company) President Jason Sciberras talks about PCB designers offering packaging options in the bill of materials. As Jason explains, mil/aero manufacturers like Saline can’t make many changes to a design without getting recertified, so including approved packaging options in the BOM from the start is a great way to go. Are you offering options in your BOM?
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week in our industry. We have a duke’s mixture of news and columns in this week’s Editor’s Choice, starting off with some good news for the American electronics manufacturing industry. In his State of the Union speech, President Biden signaled his support for the CHIPS Act and the U.S. electronics industry, and he promised that Washington would put its money where its mouth is this time. Is it going to happen? Don’t bet the rent money.
Time to ‘Finish the Job’ on PCB Funding
In his State of the Union address in early February, President Biden departed from his usual topics about education and the economy to mention the new CHIPS Act, as well as supply chain and infrastructure issues. For perspective on those remarks, Nolan Johnson chats with David Schild, executive director of the Printed Circuit Board Association of America (PCBAA).
Real Time with... IPC APEX EXPO 2023: Taking Our Message to Washington
Nolan Johnson talks with Chris Mitchell, vice president of Global Government Relations at IPC, about key issues IPC is working on today and how you can be involved in advocating for our industry in 2023. Their conversation also covers the CHIPS Act, advanced packaging, and much more.
EIPC Winter Conference 2023: Day 1 Review
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.
A Conversation With ‘The Space Gal’
With multiple advanced degrees in aerospace science, Emily Calandrelli could have had her pick of any project in earth and space science. Instead, she has chosen to use her skills in science policy and communication to break down complex science topics, advocate for women in STEM fields, and bolster enthusiasm for the next generation of scientists through her own Netflix show and an active slate of social media accounts. Emily’s platform is huge, but it's one that she wholeheartedly embraces. In this interview with the I-Connect007 Editorial Team, Emily talks about her unconventional entry into science, what’s ahead for space commerce, advice for industry leaders, and what she really thinks about going into space.
Printed Circuit Boards Have Champions on Capitol Hill
House Resolution 7677 from the 2021/22 Congressional session may have run out of time before the election cycle, but that hasn’t ended the effort to help fund the printed circuit board industry alongside the semiconductor industry. IPC vice president of global government relations, Chris Mitchell, shared this letter, sent to DOD on Wednesday by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), which insists DOD must “leverage all available resources, including the use of Title III of the Defense Production Act (DPA), to increase domestic production of PCBs and IC substrates.”
Real Time with... IPC APEX EXPO 2023: Challenges of New Product Development
John Ekis, market segment director, Aerospace and Defense, Rogers Corporation, discusses with Pete Starkey the importance of close applications engineering relationships in understanding and responding to the requirements and challenges of specialist new product development.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We have new projects in the U.S. Army space programs, research on gold thickness and solderability, a call for papers throughout 2023 from SMTA, an investment in Korean facilities by ASM, and an adjustment in TTM’s assignation with the U.S. DoD. All together, these five must-reads represent the hurtling trajectory that R&D seems to be following in 2023.
TTM Technologies Reports Fiscal Q4, 2022 Results
TTM Technologies, Inc., a leading global manufacturer of technology solutions including engineered systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB), reported results for the fourth quarter and fiscal 2022, which ended on January 2, 2023.
I-Connect007 Editor’s Choice: Five Must-Reads For the Week
It’s Feb. 3, 2023—2/3/23—and now we know the results of yesterday’s Groundhog weather forecast straight from Gobbler’s Knob in Pennsylvania. Punxsutawney Phil says six more weeks of winter. If you’re watching the ongoing ice storms blanketing much of the United States at present, that seems like a safe bet. Also a safe bet is that the most-read news this week is IPC APEX EXPO related. Additionally, this week IPC published its EMS and PCB numbers for December. All told, lots of industry news to read this week.
Don't Blink: The IPC APEX EXPO Time-lapse
It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.
A Challenge Facing Aerospace Designers In 2023
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
It’s Here: The Launch of IPC Community Magazine
IPC Community Magazine launches today at IPC APEX EXPO 2023, both in digital and print form. It is now widely available for download at no cost. This magazine helps tell the stories of IPC, particularly for IPC members who use and interact with the trade organization. IPC worked closely with I-Connect007 (IPC Publishing Group) to develop the concept for the publication, and asked John W. Mitchell, president and CEO of IPC, to share a few thoughts as he looked at the magazine for the first time in print.
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
US, Japan Sign Space Collaboration Agreement at NASA Headquarters
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O. It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.
Ventec: Contextualizing the CHIPS Act
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.
Designing a Sustainable Future
While it may be traditionally considered a PCB fab and assembly show, IPC APEX EXPO is quickly becoming a destination for PCB designers and design engineers. Flipping through this year’s schedule, I counted 15 Professional Development and Technical Conference classes that focus on PCB design, as well as several fabrication classes that many of you should probably take. I checked in with Carlos Plaza, IPC’s senior director of educational development, to discuss the organization’s drive to present more PCB design curriculum at the upcoming show and how the show can give designers the tools they need to overcome the many challenges currently facing the industry.
Essemtec: Manufacturing Moves In-house
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.
ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event
Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.
Polar Instruments: Simulating PCB Potentialities
Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
An Opportunity to Give Thanks
I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.
PCB Carolina Breaks Attendance Record
PCB Carolina has been growing consistently for the past decade, and this year the show reached a milestone: more than 1,000 attendees. Yesterday, the show was the busiest I’ve ever seen it; I almost had to park off the NC State University campus. Fortunately, I’m an expert at “the parking lot game.” I waited until a guy was leaving and then I sniped his spot. Bam!
IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
EIPC Technical Snapshot: ‘Tremendous Uncertainty’ in Global PCB Marketplace
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?
EMA Helps Ease Designers’ Supply Chain Woes
Supply chain issues are continuing to cause disruptions in our industry, though lead times have dropped from astronomical to merely troublesome. In this interview, Chris Banton, EMA Design Automation’s director of marketing, explains how Cadence’s software has evolved as designers’ needs have changed in the past few turbulent years, including providing designers with component availability data early in the process.
PCB Legislative Update: HR 7677
Electronic industry association leaders like IPC, PCBAA, and USPAE have been trekking to Capitol Hill almost weekly this year to reinforce the dire state of the industry and seek additional co-sponsors for HR 7677, a bill supporting the American printed circuit board industry. However, with only 78 days until the end of the 117th Congress, it is not likely that anything will move by the end of this session.
IPC Advanced Packaging Symposium: An Urgent Need to Support Global Efforts
After two days of presentations, panel discussions, and impromptu hallway conversation at the IPC Advanced Packaging Symposium, one thing became clear: There is an urgency to support advanced packaging in all regions across the globe. The symposium, Oct. 11-12 in Washington, D.C., concluded with what seemed to be a great deal of expanded perspective for those who attended.
IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs
There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. This was a common theme during a two-day IPC Advanced Packaging Symposium, which launched yesterday at the Kimpton Monaco hotel in Washington, D.C.
Viasat, Inmarsat Confident their Combination Benefits Consumers
Viasat Inc. and Inmarsat remain committed to working with the UK’s Competition and Markets Authority (CMA) to demonstrate how their planned transaction will benefit airline, passenger, and enterprise users of In-Flight Connectivity (IFC) in aviation businesses.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
Michael Carano: A Focus on Process Control, Part 2
In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.
The New World Order of JIC
The great business thought leader Margaret Heffernan commented that we are changing from just-in-time (JIT) to just-in-case (JIC). As we’ve worked our way through the issues of the past two years, the world is changing from a complicated to a complex system, and we must be prepared to face the challenges it brings. To survive today, we need the JIC mentality. We must be prepared for the unexpected. No longer can we rely on cycles and patterns to predict the future, or what we might be able to handle based on what that future brings. Now we must prepare for the unexpected. We must be flexible and able to adapt to whatever comes our way.
A Focus on Process Control, Part 1
Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.
Designing Through Supply Chain Pain
Engineers are accustomed to the demanding challenges of designing for miniaturization, cost reduction, cross platform compatibility, and harsh environments. What has proven to be the most painful experience of my career (and for many of my colleagues) is the sheer lack of components from which to build our designs. Development cycles—commercial, industrial, medical, avionics—have been severely impacted, from large enterprise corporations to small design/integration companies. Awareness of the situation is the first step to understanding the underlying problems faced by today’s design engineers industry wide. Here are a few of the situations I have faced in the last year alone.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?
A Deeper Look at the CHIPS Act Investment
In this interview with Chris Peters at U.S. Partnership for Assured Electronics (USPAE), Nolan Johnson seeks for better understanding regarding the implications of funding the CHIPS Act. Frankly, where and how will the $52 billion be spent? Who will decide how the funds are allocated? And surprisingly, who will benefit the most from this boost into the microelectronics industry?
IPC Advanced Packaging Symposium to Draw Industry, Government Representatives
Nolan Johnson speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium, scheduled for October 11-12, 2022 in Washington, DC. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the value to both fabricators and assemblers in attending.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.
Excerpt: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'
As the second in this two-part series, The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art builds on the material presented in the first book by describing up-to-the-minute products and design techniques for thermal management with IMS.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Our biggest news this week: I-Connect007 has been acquired by IPC. Every member of the team, including founder and Publisher Barry Matties, is included in this deal. We’ve enjoyed working closely with IPC for decades, especially at events like IPC APEX EXPO, and we have four IPC columnists writing in our magazines and newsletters. This move makes sense for both parties. It enables us to take our magazine, newsletters, and book publishing to the next level, and IPC won’t have to spend years building a media company from the ground up. It really is a win-win.
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets.
PCB Finance Class With Jeff De Serrano
Class is in session! PCB Technologies President Jeff De Serrano takes us through some of the struggles of the PCB industry over the past 30 years, how U.S. legislation seeks to level the playing field, and whether a “monopoly” of fabricators is healthy for our industry. In his chat with Nolan Johnson, Jeff gets out his investment playbook and talks strategy. Don’t miss this one.
FLEX Conference 2022: If You Build It, We Will Buy It
Key presentations from companies like Boeing highlight FLEX Conference and Exhibition 2022, held in concert with the annual SEMICON West show this week in San Francisco’s Moscone Center. SEMICON West claims to be “North America’s premier microelectronics exhibition and conference,” uniting players across the entire electronics manufacturing and design supply chain.
Time to Get Serious About CMMC Readiness
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In more than one conversation while discussing the industry this week, the themes have included industry turmoil, lots of business opportunities, and the urgent need to build out to meet changing demands. In fact, our July issue of PCB007 Magazine, which publishes later this month, will focus on these very topics. It’s definitely one not to be missed!
These themes also emerged in this week’s top five news items as well. Top stories include an acquisition in the soldering machinery space, sales and service expansion in Mexico, industry data from SIA on semiconductor global sales data, and strong financial numbers from two China-based manufacturers. Now, with the U.S. Congress putting its focus on the PCB industry, things could really heat up. It’s going to be an interesting year.
The U.S. Economy Needs the Bipartisan Innovation Act and the PCB Act
In this IPC-created interview between Dale Curtis, IPC Advocacy Communications and Chris Mitchell, IPC VP Global Government Relations, the importance of the semiconductor and PCB manufacturing legislation moving through US Congress is highlighted.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Market news was certainly big this week. While the U.S. stock market continues make some large swings, the PCB and PCBA are doing their own dance with the numbers. We’re still feeling the effects of the pandemic, but it seems to be more about playing catch up. Still, the industry is showing some instability, both in positive and negative ways.
