IPC Issues Call for Participation for IPC APEX EXPO 2019
March 14, 2018 | IPCEstimated reading time: 2 minutes
IPC — Association Connecting Electronics Industries invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. Professional development courses will take place January 27, 28 and 31, 2019 and the technical conference will take place January 29–31, 2019.
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium, MacDermid Enthone, Northrop Grumman, Oracle and Robert Bosch GmbH have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”
Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:
- 3D Printing in Electronics Manufacturing
- Automation in Electronics Manufacturing
- Adhesives
- Advanced Technology
- Area Array/Flip Chip/0201 Metric
- Assembly and Rework Processes
- BGA/CSP Packaging
- Black Pad and Other Board Related Defect Issues
- BTC/QFN/LGA Components
- Business & Supply Chain Issues
- Cleaning
- Conformal Coatings
- Corrosion
- Counterfeit Electronics
- Design
- Electromigration
- Electronics Manufacturing Services
- Embedded Passive & Active Devices
- Environmental Compliance
- Graphene in Electronics Manufacturing
- Lean Six Sigma
- LED Manufacturing
- Failure Analysis
- Flexible Circuitry
- HDI Technologies
- Head-on-Pillow
- Board and Component Warpage
- High Speed, High Frequency & Signal
- Industry 4.0
- Integrity
- Lead-Free Fabrication, Assembly & Reliability
- Miniaturization Nanotechnology Optoelectronics
- Packaging & Components
- PCB Fabrication
- PCB and Component Storage & Handling Performance
- Quality & Reliability
- Photovoltaics
- PoP (Package-on-Package)
- Printed Electronics
- Reshoring
- RFID Circuitry
- Robotics
- Soldering
- Surface Finishes
- Test, Inspection & AOI
- Tin Whiskers
- 2.5-D/3-D Component Packaging
- Underfills
- Via Plugging & Other Protection
- Wearables
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.
Technical conference paper abstracts and course proposals are due June 15, 2018. To submit an abstract or course proposal, click here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300+ member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
For more information, click here.
Suggested Items
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.