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I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

June 24, 2022 | Nolan Johnson, I-Connect007

Market news was certainly big this week. While the U.S. stock market continues make some large swings, the PCB and PCBA are doing their own dance with the numbers. We’re still feeling the effects of the pandemic, but it seems to be more about playing catch up. Still, the industry is showing some instability, both in positive and negative ways.




MORE ARTICLES

The Plating Issue Featuring:

  • Proper Plating, by Andy Shaughnessy
  • PCB Plating Still Comes Down to Physics, a conversation with Mike Carano
  • Plating Offers Plenty of Challenges—and Opportunities, a conversation with Chris Bonsell
  • Plating in Electronic Applications, by George Milad
  • Plating on Silver: What’s Old Is New Again, by Denis Jacques
  • Book Excerpt: Automation and Advanced Procedures in PCB Fabrication, by Happy Holden

The Point of Collaboration Featuring:

  • Partnership and Collaboration, Interview with Brigitte Lawrence, Christopher Kalmus, Jeff Brandman, and Dan Beaulieu
  • Anaya Vardya: An Advocate for Great Partnerships A Compilation by the I-Connect007 Editorial Team
  • What’s the Point of Collaboration? by Nolan Johnson
  • Social Responsibility and Ethics in Manufacturing by Lea Maurel
  • Resourceful Solutions During Nationwide Shortages by Emmalee Gagnon
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