Reading time ( words)
This article and subsequent follow-ups will cover various disruptive technologies. During the planning stage for this month’s issue of The PCB Magazine, I was asked to consider a number of potential topics; two of them are areas that I am very interested in—augmented reality (AR) and virtual reality (VR), and 3D printing and security. Another is a topic that I do not believe gets enough coverage—counterfeit components. Faced with a difficult choice I decided to cover not one, but all, and in order to cover them in some detail they each deserve their own research and commentary. Therefore, this will be the first of at least three articles.
The topic I chose for this month is disruptive technologies, focusing on AR, VR, and mixed reality (MR). In future articles, I will cover security issues such as phishing, hacking, malicious code insertion, etc. Then, I’ll cover new techniques and progress in 3D manufacturing (no longer limited to printing) as well as the growing problem of counterfeit components and assemblies.
As I look at these topics and their impact on the overall industry we cover, I realize that any of these are deserving of their own, more detailed and continuing coverage. After all, things are moving very fast and accelerating. They will be revisited at a later date.
So here we go with the game changing world of VR and AR, as well as mixed reality and how they differ. From there, I’ll address what to expect in the next year and how VR/AR are far more than a gaming technology (in some cases they are perhaps better than real life), and finally, how they are changing our military and aviation industries.
To read this entire article, which appeared in the September 2016 issue of The PCB Magazine, click here.
Nolan Johnson, I-Connect007
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.
Pete Starkey, I-Connect007
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.
Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.