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SMTA Europe is excited to announce the finalized program for Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 at the Crowne Plaza Amsterdam – Schiphol in Amsterdam, Netherlands.
This global conference is a strong two and a half day technical event focused on building reliable electronics used in power electronics and harsh environments. Conference sessions will include Predicting Component Life, Joining Technologies, Electrochemical Reliability, Adhesive and Coating, Advanced Test Methods, Automotive Environments and High Temperature PCB Materials and Fabrication.
Two half-day workshops will open the conference on Tuesday, April 24, 2018. The morning workshop is, “Understanding Shock & Vibration” and Alex Feinberg, Ph.D., DfR Software, will instruct the course. Martin Wickham, National Physical Laboratory, will instruct the workshop "Increasing the Performance of Organic PCBs at Higher Temperatures Workshop" in the afternoon.
On Wednesday, April 25, Ralph C. Tuttle, Cree, Inc., will provide his keynote presentation on “High Power LED Solder Joint Reliability.”
On Thursday, April 26, the program will focus primarily on automotive applications. Dwight Howard, APTIV (formerly Delphi Automotive), will provide his keynote presentation on “Automotive Electronics: Durability in the Face of Harsh Environments.” The afternoon session, co-organized by iNEMI, will feature a presentation, panel discussion, and breakout groups.
A co-located table-top expo will showcase additional solutions from leading companies focused on improving reliability for electronics operating in harsh environments. The expo will run April 24-26, concurrently with the conference.
Register to become a SMT Processes Certified Engineer at the Electronics in Harsh Environments Conference. Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes. The program concludes on days two and three with an open and closed book examination.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.
05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.
04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.