Optomec Launches 20-Micron Resolution Printer for High Density Electronics Packaging
February 27, 2018 | OptomecEstimated reading time: 2 minutes
Optomec announced the Aerosol Jet HD System designed to address today’s most demanding electronics packaging challenges - the increasing density of electronic components. The Aerosol Jet HD System is a compact, configurable production platform that can dispense a wide range of electronics materials with features as small as 20 microns. The system can also produce larger features, from 100’s of microns to millimeters, and print wide-area conformal coatings from 100 nanometers to 10’s of microns in thickness. The solution will be on display for the first time at IBC/APEX (February 27 - March 1, 2018 in booth no. 3800).
The Aerosol Jet HD System is based on Optomec's patented Aerosol Jet technology, a fine-feature material deposition solution used to directly print functional electronic circuitry and components onto low-temperature, non-planar substrates, without the need for masks, screens or subtractive post-processing. Based on the next-generation of Optomec’s production-proven Aerosol Jet print engine, coupled with in-line automation, the HD System can handle a variety of substrate sizes and compositions, providing high-resolution printed electronics for today’s most demanding advanced packaging applications such as 3D interconnects, conformal RF/EMI shielding, and precision micro-dispense of insulators and adhesives.
“The demand for miniaturization of electronic systems, especially in mobile device, medical and mil-aero applications, has exposed a technology gap in advanced electronics packaging that current dispense solutions cannot address. With this announcement, Optomec offers a practical, seamless and cost-effective solution that can deliver an order of magnitude improvement in dispense resolution, addressing the advanced packaging needs of today and providing a pathway far into the future,” said Dave Ramahi, CEO, of Optomec.
The compact, modular design of the Aerosol Jet HD System enables it to easily plug into almost any existing manufacturing environment to fill production gaps and provide new capabilities. The solution provides a turn-key approach to advanced electronics packaging with the Aerosol Jet Print Engine and tool path generation software integrated into a standard dispense automation platform.
In addition, production-ready recipes for a range of conductive, dielectric, adhesive and other materials, capable of extended runtimes and high yields are available with the initial product release.
Additional benefits of the new system include:
- Modular, interchangeable material cassettes and interchangeable print heads
- Ability to address printing requirements from small features (20 to 100 micron line width) to wide area coatings (millimeters to centimeters)
- Process runtimes exceeding 4 hours for production applications
Pricing and Availability
The Aerosol Jet HD platform, which includes the Aerosol Jet Print Engine, has an entry price of less than $150K. Product shipments are scheduled for late Q218.
About Optomec
Optomec is a privately-held, rapidly growing supplier of Additive Manufacturing systems. Optomec’s patented Aerosol Jet Systems for printed electronics and LENS 3D Printers for metal components are used by industry to reduce product cost and improve performance. Together, these unique printing solutions work with the broadest spectrum of functional materials, ranging from electronic inks to structural metals and even biological matter. Optomec has more than 200 marquee customers around the world, targeting production applications in the electronics, energy, life sciences and aerospace industries. For more information about Optomec, click here.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.