I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.

Medical Device Standard Reaches New Milestone
Published July 6

Passing the ballot after industry review is a major milestone in the development of a standard. IPC-6012 has accomplished this step. Forward progress on standards in medical devices is very topical right now, and readership showed that interest. 

Catching Up With Fane Friberg: Supply Chain Management Expert
Published July 3

“Supply chain” is a key phrase in our sector right now. Everybody is paying attention to the supply chain, and everybody pays attention to Dan Beaulieu, too. So, when Dan interviews a new supply chain subject-matter expert, it was sure to have strong readership.

Understanding MIL-PRF-31032, Part 1
Published July 7

American Standard Circuits’ Anaya Vardya launched a series on MIL-RF-31032 and drew some of the highest readership of the week in just 24 hours. Anaya found a high-interest topic.

AltiumLive 2020 Goes Virtual
Published July 6

Altium’s annual user community conference, AltiumLive, is moving to an online experience this year, like many trade shows and conferences that have responded similarly. This news item makes the top five due to the unique experience that AltiumLive traditionally provides.

Chris Hanson: New Ventec Dialectrics Rated for Higher Temps
Published July 7

With Andy Shaughnessy facilitating the interview, Ventec International Group’s Chris Hanson discusses new IMS materials, including one that is UL-rated for a max operating temperature of 155°C—possibly the highest rating for any IMS dielectric.

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NIST Resources for CHIPS Act Participants

01/27/2023 | Nolan Johnson, I-Connect007
At the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/27/2023 | Nolan Johnson, I-Connect007
This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.

Integra: Redefining Die Prep in the U.S.

01/25/2023 | Matt Bergeron, Integra
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.



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