StratEdge Packaging, Assembly Services Expands for High-Frequency and High-Power Devices
September 28, 2022 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices from DC to 63+ GHz at the International Symposium for Microelectronics (IMAPS) 2022 and BCICTS. StratEdge will be exhibiting in booth 317 at IMAPS, being held in Boston, Massachusetts on Oct. 4-5, and in booth 5 at BCICTS, being held in Phoenix, Arizona from Oct. 17-18.
StratEdge designs, manufactures, and provides assembly services for RF and microwave packages with applications in the telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole markets. The packages have ultra-low losses over wide frequencies. Their high-reliability designs have high thermal conductivity and 50 ohm impedance transition designs.
StratEdge not only makes the packages but provides complete assembly and lidding services for them. Assembly is done in StratEdge's ISO 9001:2015 facility that contains a Class 1000 cleanroom and Class 100 work areas with workstations for performing sensitive operations. Assembly services cover manual to fully automatic wire and die bonding, using wire or ribbon wedge bonding and a proprietary eutectic die attach technology. StratEdge has expertise in assembling microwave and RF devices in California since 1999.
"Working with compound semiconductors, such as gallium nitride, requires a package that can best dissipate the heat from the device while ensuring that the device is performing at its optimum potential," said Casey Krawiec, VP global sales for StratEdge. "Although the package plays the most critical part, the way the chip is packaged can also make a significant difference in the device's performance. Please stop by our booth at IMAPS or BCICTS to discuss your application."
Suggested Items
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
IPC WinterCom 2024 Through the Eyes of One Dedicated Student
04/12/2024 | Sanjay Huprikar, IPCLauriane Testuz stands as a testament to the power of curiosity, perseverance, and the relentless pursuit of knowledge. Her story serves as a reminder that the path to success is often paved by an unwavering commitment to one's dreams.
2023: Year of Extremes for VDL Groep
04/08/2024 | VDL GroepThe year 2023 showed us two sides, with highs and lows. Low points were the passing of Wim van der Leegte in November, the reduction in the number of employees at VDL Nedcar and headwind in the Buses & Coaches division.
IPC, First and Only Organization in the Electronics Industry to Earn ANSI/ANAB Accreditation for Its Workforce Training
04/02/2024 | IPCIPC, the global leader in electronics education, announces a landmark achievement in professional education and training. Ten of IPC’s critical workforce training programs have been accredited by the ANSI National Accreditation Board (ANAB) under the stringent requirements of ANSI/ASTM E2659-18, Standard Practice for Certificate Programs.