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Elbit Systems Ltd. announced that it was awarded a contract valued at $120 million to supply Hermes 900 Maritime Unmanned Aircraft Systems (UAS) and training capabilities to the Royal Thai Navy. The contract will be performed over a three-year period.
Under the contract, Elbit Systems will provide the Rroyal Thai Navy with Hermes 900 Maritime UAS featuring maritime radar, Electro Optic payload, Satellite Communication, droppable inflated life rafts and other capabilities. The Hermes 900 Maritime UAS is intended to enable the Rroyal Thai Navy to perform both blue water and littoral missions, dominate vast swathes of sea and long coastlines, communicate with operational vessels and carry out civilian mission such as maritime Search and Rescue and identification of suspicious activities and potential hazards.
UAS of the Hermes family have been selected to date by more than 20 customers including Israel, the UK, Switzerland, Canada, the United Nations, the European Union, Brazil, Chile, Mexico and others; attesting to their competitive edge combining technological sophistication, reliability, open architecture and a solid growth path.
Yoram Shmuely, General Manager of Elbit Systems Aerospace, commented: “This is yet another vote of confidence in the Hermes family of UAS. We are experiencing a growing demand around the globe for our unmanned solutions that are capable of effective integration with operational activities of manned forces across domains of operation, addressing a wide range of evolving threats.”
Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.